A nickel barrier layer is a functional intermediate layer on a wire positioned between the base material and the outer coating. It can help limit diffusion processes, increase surface stability and adjust the properties of a coating system in a targeted way.
In the field of electronic wire, bedra offers various surface coatings, ranging from pure tin coatings and variants with nickel or copper barrier layers to multi-layer technology.
Depending on the application, the barrier layer can be an important element for adapting the surface to subsequent processing or assembly steps.
Nickel barrier layers are particularly relevant for applications where solderability, contact behavior, corrosion requirements, process reliability and reproducible quality must work together.
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