MouldMet300

Copper Nickel Silicon

Characteristics:

This product offers high strength and hardness, excellent wear resistance, and outstanding electrical and thermal conductivity. When used as a mold material, it enables rapid and uniform heat dissipation, effectively shortening molding cycles. Its low friction coefficient also makes it easy to grind and polish.

Typical applications:

This alloy is widely used for cores and inserts in blow molds and injection molds, as well as plunger tips for die-casting machines.

Standardization and composition

UNS /
EN /
JIS /
GB /
Cu Balance
Ni ≤6.5-8.0%
Si ≤1.5-3.0%
Cr ≤0.6-1.5%

Similar Material Designation

Chemical Composition

Physical properties①

Note①:The testing temperature is 20℃. Note②:The testing temperature range is 20℃ to 300℃.

Density (g/cm³) 8.67
Electrical conductivity (%IACS) ≥ 35
Thermal conductivity ( W/m·K) 145
Coefficient of thermal expansion② (10-6/K) 17.5
Modulus of elasticity (GPa) 135

Mechanical Properties③

Note③:As forged, thickness < 180mm

Tensile Strength(MPa) 750
Yield Strength(MPa) 680
Elongation(%) 4
Hardness(HRC) 25

Berkenhoff GmbH (headquarters)

  • Kinzenbach plant
  • Berkenhoffstrasse 14
  • 35452 Heuchelheim
  • Germany

Berkenhoff GmbH

  • Merkenbach plant
  • Rehmühle 1
  • 35745 Herborn
  • Germany

bedra Vietnam Alloy Material Co., Ltd

  • Lot CN-06, Hoa Phu Industrial Park,
    Mai Dinh Commune,
    Hiep Hoa District, Bắc Ninh Province,
    Vietnam
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