MouldMet300

Copper Nickel Silicon

Characteristics:

It is a high-performance alloy with low nickel and silicon content. It is precipitation hardened, offering high strength, hardness, good electrical conductivity, excellent wear resistance, and superior formability. It is an ideal substitute for beryllium copper alloys.

Typical applications:

It is mainly used for cores and inserts in blow molding and injection molding molds, as well as die parts in die casting.

Standardization and composition

UNS /
EN /
JIS /
GB /
Cu Balance
Ni ≤6.5-8.0%
Si ≤1.5-3.0%
Cr ≤0.6-1.5%

Physical properties①

Note①:The testing temperature is 20℃. Note②:The testing temperature range is 20℃ to 300℃.

Density (g/cm³) 8.67
Electrical conductivity (%IACS) ≥ 35
Thermal conductivity ( W/m·K) 145
Coefficient of thermal expansion② (10-6/K) 17.5
Modulus of elasticity (GPa) 135

Mechanical Properties③

Note③:As forged, thickness < 180mm

Tensile Strength(MPa) 750
Yield Strength(MPa) 680
Elongation(%) 4
Hardness(HRC) 25

Berkenhoff GmbH (headquarters)

  • Kinzenbach plant
  • Berkenhoffstrasse 14
  • 35452 Heuchelheim
  • Germany

Berkenhoff GmbH

  • Merkenbach plant
  • Rehmühle 1
  • 35745 Herborn
  • Germany

bedra Vietnam Alloy Material Co., Ltd

  • Lot CN-06, Hoa Phu Industrial Park,
    Mai Dinh Commune,
    Hiep Hoa District, Bắc Ninh Province,
    Vietnam
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