blacspark with new blac layer is significantly different than typical Gamma class wires. The blac technology is an innovative reconstituted structure that combines a microstructured surface with tiny aggregates of semiconductor materials, which are uniformly distributed and embedded into the surface. As a result, more energy is transferred into the workpiece with each spark, thus increases the amount of material removed with each spark. Combined with the consistency of particle distribution the coating promotes better stability and a higher percentage of cutting pulses to be directed to the workpiece. The result is a faster cutting speed.
Find further product information on our blacspark detail page
PDF Datasheet | EN
Core | CuZn37 |
Surface | Reconstituted structure |
Color | Black |
Tensile strength | 900 MPa / 130,000 PSI |
Elongation | 1% |
Conductivity | 20% IACS |
Diameter | 0.20 / 0.25 / 0.30 mm |